Method of forming low resistance void-free contacts
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United States of America Patent
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Nov 10, 2009
Grant Date -
Jun 7, 2007
app pub date -
Dec 6, 2005
filing date -
Dec 6, 2005
priority date (Note) -
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Abstract
A plug is formed by depositing a first material to partially fill an opening, leaving an unfilled portion with a lower aspect ratio than the original opening. A second material is then deposited to fill the remaining portion of the opening. The first material has good filling characteristics but has higher resistivity than the second material. The second material has low resistivity to give the plug low resistance.
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