Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 10, 2009
Grant Date -
Oct 11, 2007
app pub date -
Feb 8, 2007
filing date -
Mar 24, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A sensor includes: a semiconductor chip having a sensing portion and a first bump; a circuit chip having a second bump; and a resin film having a groove. The semiconductor chip and the circuit chip are integrated with sandwiching the resin film therebetween. The resin film includes a first space and a second space before the first bump is bonded to the second bump. The first space faces the sensing portion. The second space is disposed on a periphery of the first space. The resin film expands when the first bump is bonded to the second bump. The second space accommodates an expanded portion of the resin film. The first space provides the groove after the first bump is bonded to the second bump.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully