Package for semiconductor acceleration sensor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 10, 2009
Grant Date -
Feb 1, 2007
app pub date -
Jun 29, 2006
filing date -
Jul 27, 2005
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device comprises a package having a cavity in the interior thereof, a chip having a semiconductor element, a board having the chip fixed to a first region on the upper face thereof, and an adhesive portion formed in a second region on the bottom face of the board in order to fix the board to a first face of the cavity, the second region being a region on the board other than the region thereof underneath the first region.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully