Solder flow stops for semiconductor die substrates
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United States of America Patent
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-
Nov 10, 2009
Grant Date -
Nov 17, 2005
app pub date -
Apr 21, 2005
filing date -
Apr 21, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A substrate, which has semiconductor die arranged thereon, uses at least one solder flow stop, closely surrounding at least a portion of at least one mounting pad on which the die are mounted, to prevent die rotation during solder reflow. The at least one solder stop is non-wetting, during a solder reflow process, to solder used to mount the die.
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