Camera module, manufacturing method of camera module, electronic apparatus, and manufacturing method of electronic apparatus
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United States of America Patent
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Nov 17, 2009
Grant Date -
Jun 16, 2005
app pub date -
Dec 6, 2004
filing date -
Dec 11, 2003
priority date (Note) -
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Abstract
An optical structure is disposed on a surface of a device substrate, and a lens system for introducing external light into a solid-state image pickup device is placed in the center of the optical structure. The outer shape of the optical structure seen from the light incident side of the lens system is rectangular, and its plane shape forms a rectangular frame section. An intermediate structure is disposed between the device substrate and the optical structure. The intermediate structure has a fitting section for fitting the optical structure in a part of side faces of the frame section.
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