Device for making an in-mold circuit

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7621043
APP PUB NO 20070098942A1
SERIAL NO

11554237

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A poly sheet continuously moving in a machine direction is heated to a temperature just below its glass thermal temperature to make the poly malleable. A circuit (e.g., RFID chip, EAS chip, transponder, IC) is placed on the poly sheet and embedded into the poly sheet, preferably with a heat resistant soft (e.g., rubber) roller that presses the circuit into the poly without breaking the circuit. A conductive strip or wire may be applied on or into the poly sheet to align with connection points (e.g., conductive bumps) of the circuit for conductive communication with the circuit. The conductive strip or wire is preferably cut to form gaps that are nonconductive between the cut sections of wire to avoid shorting of the circuit and/or allow the conductive strip or wire to function as an antenna for the circuit, and thus to form a chip strap or tag. The poly sheet thus provides a protective womb or shield for the circuit and wire.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
CHECKPOINT SYSTEMS INTERNATIONAL GMBH69434 HIRSCHHORN/NECKAR

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cote, Andre Williamstown , US 93 1230
Duschek, Detlef Sensbachtal , DE 21 138

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