Method of encapsulating an organic light-emitting device
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United States of America Patent
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Nov 24, 2009
Grant Date -
May 10, 2007
app pub date -
Nov 9, 2005
filing date -
Nov 9, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
A method of encapsulating an organic light-emitting device is disclosed, wherein the device includes a light-emitting portion and an electrical contact portion, the method including forming a polymer layer over the light-emitting portion and the electrical contact portion of the device; forming a separation in the polymer layer between a portion of the polymer layer disposed over the light-emitting portion of the device and a portion of the polymer layer disposed over the electrical contact portion of the device; adhering a film removal structure to the portion of the polymer layer disposed over the electrical contact portion of the device; and removing the film removal structure, thereby causing the removal of the portion of the polymer layer disposed over the electrical contact portion of the device.
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