Integrated circuit package system including high-density small footprint system-in-package
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United States of America Patent
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Nov 24, 2009
Grant Date -
May 3, 2007
app pub date -
Oct 29, 2005
filing date -
Oct 29, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are provided on the substrate, the solder separators having flattened tops at a predetermined height above the substrate. A die is supported on the solder separators above the substrate.
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