dielectrics using a rapid curing process
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 24, 2009
Grant Date -
Mar 24, 2005
app pub date -
Mar 10, 2004
filing date -
Sep 23, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method of forming a low dielectric constant structure. The method comprises providing at a first temperature a dielectric material having a first dielectric constant and a first elastic modulus, and curing the dielectric material by a thermal curing process, in which the material is heated to a second temperature by increasing the temperature at an average rate of at least 1° C. per second. As a result a densified, dielectric material is obtained which has a low dielectric constant.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully