High-speed RFID circuit placement method and device
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United States of America Patent
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Nov 24, 2009
Grant Date -
Oct 26, 2006
app pub date -
Jun 9, 2005
filing date -
Apr 25, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A high-speed machine and method for placing an RFID circuit onto an electrical component includes separating an RFID circuit from a web of RFID circuits, and placing the RFID circuit onto an electrical component with a placing device. The separating includes directing the RFID circuit onto a transfer drum of the placement device and separably coupling the RFID circuit to the transfer drum. According to one method, a separator device separates and directs chips or interposers onto a placement device. According to another method, chips or interposers are tested before being separated from a web, and if good, are separated from the web, directed onto a placement device, and placed on an electrical component. If defective, the chips or interposers are not directed onto a placement device and are removed by a scrap web removal device.
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