Hygroscopic molding

United States of America Patent

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Dec 1, 2009
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Nov 17, 2005
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Jul 7, 2003
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Jul 8, 2002

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Abstract

The present invention provides a moisture-absorbent formed body comprising 1) an amine compound and/or a thermally conductive material, 2) a hygroscopic agent, and 3) a resin component, for removing moisture from within the sealed atmosphere of an organic electroluminescent device, and thereby suppressing the occurrence of dark spots.

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DYNIC CORPORATION	KYOTO-SHI KYOTO 615-0812

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Inventor Name	Address	# of filed Patents	Total Citations
Kawaguchi, Yohei	Inugami-gun , JP	61	320
Maki, Hidehiko	Inugami-gun , JP	2	10
Miyazawa, Kentaro	Inugami-gun , JP	2	10
Nakajima, Yusuke	Inugami-gun , JP	35	137
Ohyama, Kaneto	Inugami-gun , JP	8	40
Uchibori, Teruo	Inugami-gun , JP	4	33

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Hygroscopic molding

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United States of America Patent

10520444

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PATENT NO	7625638
APP PUB NO	20050255285A1
SERIAL NO	10520444
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
December 01, 2009	US,7625638,B2 US7625638B2	GRANTED PATENT AS SECOND PUBLICATION
November 17, 2005	US,20050255285,A1 US20050255285A1	FIRST PUBLISHED PATENT APPLICATION

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10520444

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