Semiconductor package with a controlled impedance bus
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United States of America Patent
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Dec 1, 2009
Grant Date -
Jun 22, 2006
app pub date -
Feb 14, 2006
filing date -
Dec 23, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.
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