Tapered hollow metallic microneedle array assembly and method of making and using the same
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United States of America Patent
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Dec 8, 2009
Grant Date -
Apr 20, 2006
app pub date -
Oct 15, 2004
filing date -
Oct 15, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention includes device, system, method of using and making a microneedle array including the steps of forming one or more pins on a substrate, depositing one or more layers on the one or more pins and the substrate, exposing a portion of the one or more pins, and separating the one or more pins from the one or more layers to form the hollow microneedle array.
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