Surface roughening method for embedded semiconductor chip structure
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United States of America Patent
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Dec 8, 2009
Grant Date -
Nov 23, 2006
app pub date -
May 12, 2006
filing date -
May 9, 2005
priority date (Note) -
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Abstract
A surface roughening method for an embedded semiconductor chip structure is proposed. The method includes providing a carrier board with an opening and mounting a semiconductor chip in the opening of the carrier board, the semiconductor chip having a plurality of electrode pads; and performing a surface roughening process on a surface of the electrode pads of the semiconductor chip, so as to form a rough structure on a surface of the semiconductor chip exposed by the opening of the carrier board. Thus, adhesion between the chip and a dielectric layer is improved during subsequently forming circuit build-up layers on the roughened surface of the semiconductor chip and on the surface of carrier board.
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