Apparatus and method for reducing slippage between structures in an interferometric modulator
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United States of America Patent
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Dec 8, 2009
Grant Date -
Mar 30, 2006
app pub date -
Aug 12, 2005
filing date -
Sep 27, 2004
priority date (Note) -
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Abstract
A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.
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