Methods of packaging microelectronic imaging devices
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United States of America Patent
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Dec 15, 2009
Grant Date -
Oct 27, 2005
app pub date -
Apr 27, 2004
filing date -
Apr 27, 2004
priority date (Note) -
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Abstract
Microelectronic imaging devices and methods of packaging microelectronic imaging devices are disclosed herein. In one embodiment, the microelectronic imaging devices include an interposer substrate and a plurality of imager units coupled to the interposer substrate. The interposer substrate includes a plurality of openings and a plurality of contact arrays proximate to corresponding openings. The individual imager units include a microelectronic die with an image sensor and a plurality of bond-pads electrically coupled to the image sensor. The image sensors are aligned with corresponding openings on the interposer substrate, and the bond-pads are electrically coupled to corresponding contacts on the interposer substrate.
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