Semiconductor package
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United States of America Patent
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Dec 15, 2009
Grant Date -
N/A
app pub date -
May 24, 2006
filing date -
May 24, 2006
priority date (Note) -
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Abstract
Disclosed are a semiconductor package and a method of making the same. In the semiconductor package, a substrate and a semiconductor die are covered with and encapsulated by vertically pressing thermosetting resin having fluidity in a predetermined temperature range and denaturalizing itself in gel. Thus, it is possible to reduce a thickness of the semiconductor package and prevent wire sweeping.
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