Heat resistant microporous film
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United States of America Patent
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Dec 22, 2009
Grant Date -
N/A
app pub date -
Oct 20, 2000
filing date -
Oct 22, 1999
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Abstract
A heat resistant microporous membrane containing a thermoplastic resin having a crystalline melting point of 140-300° C. and having a layer structure formed in the direction of membrane thickness, said layer structure containing 5-100% of a layer defined by the following (A) and 95-0% of a layer defined by the following (B):(A) a layer in which the micropores are intra-spherulitic voids, and(B) a layer in which the micropores are intra-spherulitic voids and inter-spherulitic voids.
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