Method of retaining a substrate to a wafer chuck
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United States of America Patent
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-
Dec 29, 2009
Grant Date -
Aug 3, 2006
app pub date -
Jan 31, 2005
filing date -
Jan 31, 2005
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of retaining a substrate to a wafer chuck. The method features accelerating a portion of the substrate toward the wafer chuck, generating a velocity of travel of the substrate toward the wafer chuck, and reducing the velocity before the substrate reaches the wafer chuck. In this manner, the force of impact of the portion with the wafer chuck is greatly reduced, which is believed to reduce the probability that the structural integrity of the substrate, and layers on the substrate and/or the wafer chuck, are damaged.
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