Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving
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United States of America Patent
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Dec 29, 2009
Grant Date -
Dec 24, 2009
app pub date -
Jun 12, 2009
filing date -
Jun 26, 2007
priority date (Note) -
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Abstract
The disclosed embodiments relate to the formation of an electrical contact using a skiving technique. The electrical contact includes a spring structure that has been skived away from an underlying metal body, but the spring remains coupled with the metal body which provides a base for the spring structure. The skived spring portion of the electrical contact may comprise a cantilever-like spring, a coil-like spring, or any other suitable type of spring. Such a spring contact may be used to form an electrical connection between an integrated circuit device and a circuit board (or other substrate). Other embodiments are described and claimed.
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