Method and apparatus for backlighting a wafer during alignment
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United States of America Patent
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Dec 29, 2009
Grant Date -
Mar 15, 2007
app pub date -
Sep 14, 2005
filing date -
Sep 14, 2005
priority date (Note) -
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Abstract
A method and apparatus is provided for illuminating a wafer during wafer alignment using machine vision. An illumination device is fabricated using electroluminescent material, that provides diffuse illumination uniformly over the surface of the lamp to provide backlighting of the wafer. Contrast between the image of the wafer and the diffuse illumination produce edge features in the image that can be analyzed to determine the position and orientation of the wafer.
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