Method for fabricating a structure for a microelectromechanical systems (MEMS) device
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United States of America Patent
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Jan 5, 2010
Grant Date -
Jan 31, 2008
app pub date -
Jul 30, 2007
filing date -
Feb 12, 2002
priority date (Note) -
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Abstract
The invention provides a microfabrication process which may be used to manufacture a MEMS device. The process comprises depositing one or a stack of layers on a base layer, said one layer or an uppermost layer in said stack of layers being a sacrificial layer; patterning said one or a stack of layers to provide at least one aperture therethrough through which said base layer is exposed; depositing a photosensitive layer over said one or a stack of layers; and passing light through said at least one aperture to expose said photosensitive layer.
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