Methods and apparatus for packaging integrated circuit devices
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United States of America Patent
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Jan 5, 2010
Grant Date -
Jan 17, 2008
app pub date -
Aug 13, 2007
filing date -
Jun 16, 2003
priority date (Note) -
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Abstract
An integrally packaged integrated circuit device including an integrated circuit die including a crystalline substrate having first and second generally planar surfaces and edge surfaces and an active surface formed on the first generally planar surface, at least one chip scale packaging layer formed over the active surface and at least one electrical contact formed over the at least one chip scale packaging layer, the at least one electrical contact being connected to circuitry on the active surface by at least one pad formed on the first generally planar surface.
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