US Patent No: 7,643,305

Number of patents in Portfolio can not be more than 2000

System and method of preventing damage to metal traces of flexible printed circuits

Stats

ALSO PUBLISHED AS: 20090231816
ATTORNEY / AGENT: (SPONSORED)
 

Importance

Loading Importance Indicators... loading....

Abstract

Stiffeners in are provided in a flexible printed circuit to prevent damages to leads and traces of the flexible circuit caused by bending, folding and other stresses.

Loading the Abstract Image... loading....

First Claim

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
QUALCOMM MEMS TECHNOLOGIES, INC.SAN DIEGO, CA589

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Peng Cheng Cupertino, CA 8 30

Cited Art

Patent Info (Count) # Cites Year
 
QUALCOMM MEMS TECHNOLOGIES, INC. (15)
6,040,937 Interferometric modulation 571 1996
6,674,562 Interferometric modulation of radiation 593 1998
7,123,216 Photonic MEMS and structures 480 1999
6,680,792 Interferometric modulation of radiation 455 2001
6,574,033 Microelectromechanical systems device and method for fabricating same 398 2002
7,110,158 Photonic MEMS and structures 157 2002
7,161,728 Area array modulation and lead reduction in interferometric modulators 128 2003
2005/0046,922 Interferometric modulation pixels and manufacturing method thereof 215 2004
7,012,732 Method and device for modulating light with a time-varying signal 53 2005
7,310,179 Method and device for selective adjustment of hysteresis window 8 2005
7,327,510 Process for modifying offset voltage characteristics of an interferometric modulator 142 2005
7,355,782 Systems and methods of controlling micro-electromechanical devices 6 2006
2008/0084,601 SYSTEM AND METHOD FOR A MEMS DEVICE 6 2007
2008/0106,784 METHOD AND DEVICE FOR SELECTIVE ADJUSTMENT OF HYSTERESIS WINDOW 2 2007
2008/0191,978 APPARATUS FOR DRIVING MICROMECHANICAL DEVICES 9 2008
 
SAMSUNG ELECTRONICS CO., LTD. (2)
5,394,297 Apparatus and method for reducing bending stress on an electrical cable using a freely rotatable bushing 21 1994
6,252,298 Semiconductor chip package using flexible circuit board with central opening 73 1998
 
STANLEY BLACK & DECKER, INC. (2)
5,798,907 Wearable computing device with module protrusion passing into flexible circuitry 44 1996
6,271,477 Long-lasting flexible circuitry 1 1998
 
TEMIC AUTOMOTIVE OF NORTH AMERICA, INC. (2)
6,483,037 Multilayer flexible FR4 circuit 7 2001
6,927,344 Flexible circuit board assembly 13 2004
 
TEXAS INSTRUMENTS INCORPORATED (2)
4,954,789 Spatial light modulator 524 1989
5,485,304 Support posts for micro-mechanical devices 118 1994
 
ANDO ELECTRIC CO., LTD. (1)
4,832,621 Probe for in-circuit emulator 10 1987
 
DIGITAL OPTICS CORPORATION (1)
2005/0285,973 System and method for mounting an image capture device on a flexible substrate 23 2004
 
FLEXTRONICS AP, LLC (1)
2007/0254,117 Conductive Stiffener for a Flexible Substrate 2 2006
 
FORMFACTOR, INC. (1)
2004/0113,250 Integrated circuit assembly 7 2002
 
FUJIKURA LTD. (1)
2007/0049,060 Printed circuit board and manufacturing method thereof 1 2006
 
HITACHI VIA MECHANICS, LTD. (1)
2006/0270,232 Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used therefor 3 2006
 
INTEL CORPORATION (1)
4,850,883 High density flexible circuit connector 36 1987
 
LENOVO (SINGAPORE) PTE LTD. (1)
6,223,393 Redundant hinge element for a notebook computer 7 1999
 
LG ELECTRONICS INC. (1)
7,384,272 Flexible printed circuit board assembly, method for manufacturing the same, and portable terminal comprising the same 2 2006
 
MASSACHUSETTS INSTITUTE OF TECHNOLOGY (1)
5,784,189 Spatial light modulator 240 1995
 
NORTHFIELD ACQUISITION CO. (1)
5,004,639 Rigid flex printed circuit configuration 49 1990
 
RUWEL AG (1)
7,238,891 Circuit board with at least one rigid and at least one flexible area and process for producing rigid-flexible circuit boards 3 2003
 
SAMSUNG DISPLAY CO., LTD. (1)
2007/0134,473 Flexible circuit film and display panel assembly having the same 1 2006
 
VIASYSTEMS CORPORATION (1)
4,756,940 Flexible circuit strain relief 22 1986

Patent Citation Ranking

Forward Cites

  • No Forward Cites to Display

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
3.5 Year Payment $1600.00 $800.00 $400.00 Jul 5, 2013
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 5, 2017
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 5, 2021
Fee Large entity fee small entity fee micro entity fee
Surcharge - 3.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00