On chip temperature measuring and monitoring method
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United States of America Patent
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Jan 12, 2010
Grant Date -
Aug 7, 2008
app pub date -
Apr 3, 2008
filing date -
Apr 14, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A device temperature measurement circuit, an integrated circuit (IC) including a device temperature measurement circuit, a method of characterizing device temperature and a method of monitoring temperature. The circuit includes a constant current source and a clamping device. The clamping device selectively shunts current from the constant current source or allows the current to flow through a PN junction, which may be the body to source/drain junction of a field effect transistor (FET). Voltage measurements are taken directly from the PN junction. Junction temperature is determined from measured junction voltage.
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