Modular solid-state laser platform based on coaxial package and corresponding assembly process
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United States of America Patent
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Jan 19, 2010
Grant Date -
May 24, 2007
app pub date -
Sep 19, 2006
filing date -
Sep 20, 2005
priority date (Note) -
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Abstract
Application of a modular coaxial package design, compatible with telecommunication passive component packaging, to microchip lasers, in particular to passively Q-switched microlasers, pumped with a fiber-coupled diode, is disclosed. The number of parts is thereby reduced while providing the adequate degrees of freedom for the active or passive alignment of the optical elements within the package.
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