Wafer level interposer
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United States of America Patent
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Jan 19, 2010
Grant Date -
Oct 30, 2008
app pub date -
Jul 8, 2008
filing date -
Mar 16, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on said first side of said substrate, and a second plurality of contact elements disposed on said second surface of said substrate, wherein said interposer connects electronic devices via said first and said second plurality of contact elements.
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