Semiconductor devices and methods of manufacturing semiconductor devices
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United States of America Patent
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Jan 26, 2010
Grant Date -
May 31, 2007
app pub date -
Nov 1, 2006
filing date -
Nov 2, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a semiconductor device and a method of manufacturing a semiconductor device. A semiconductor device may include an insulating layer and a metal interconnection. An insulating layer may include a first layer including fluorine and a second layer including SRO (silicon rich oxide) having a dangling bond. A metal interconnection may be formed over the insulating layer.
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