Micro chip-scale-package system

United States of America Patent

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Jan 26, 2010
Grant Date
Feb 7, 2008
app pub date
Oct 9, 2007
filing date
Apr 22, 2005

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Abstract

A micro chip-scale-package system including providing a metal pattern on an adhesion material, attaching an integrated circuit die to the metal pattern, and molding an encapsulant over the integrated circuit die and the metal pattern.

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Patent Owner	Address
STATS CHIPPAC MANAGEMENT PTE LTD	SINGAPORE

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Kim, Jong Kook	Suwon, KR	15	121
Lee, Hun Teak	Ichon, KR	24	115
Lee, Jason	Seoul, KR	126	3843

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Micro chip-scale-package system

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United States of America Patent

11869737

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PATENT NO	7652382
APP PUB NO	20080029861A1
SERIAL NO	11869737
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
January 26, 2010	US,7652382,B2 US7652382B2	GRANTED PATENT AS SECOND PUBLICATION
February 07, 2008	US,20080029861,A1 US20080029861A1	FIRST PUBLISHED PATENT APPLICATION

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11869737

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