Stackable semiconductor package having metal pin within through hole of package
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United States of America Patent
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Feb 2, 2010
Issued Date -
N/A
app pub date -
Jun 6, 2007
filing date -
Feb 5, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.
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