US Patent No: 7,656,678

Stacked module systems

Stats

Feb 2, 2010
Issued date
Oct 31, 2005
filing date
11/263,627
serial no
In Force
status

ALSO PUBLISHED AS: 20060092614

Importance

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Abstract

The present invention stacks integrated circuit packages into circuit modules. In a preferred embodiment, solder paste and primary adhesive respectively are applied to selected locations on the flex circuitry. Supplemental adhesive is applied to additional locations on the flex circuitry, CSP, or other component. The flex circuitry and the CSP are brought into proximity with each other. During solder reflow operation, a force is applied and the CSP collapses toward the flex circuitry, displacing the primary adhesive and the supplemental adhesive. The supplemental adhesive establishes a bond providing additional support to the flex circuitry. In another embodiment, CSPs or other integrated circuit packages are bonded to each other or to other components with a combination of adhesives. A rapid bond adhesive maintains alignment of the bonded packages and/or components during assembly, and a structural bond adhesive provides additional strength and/or structural integrity to the bond.

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First Claim

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Related Publications

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Patent Owner(s)

Patent Owner	Address	Total Patents
OVID DATA CO. LLC	WILMINGTON, DE	132

International Classification(s)

H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

[Classification Symbol]

[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Partridge, Julian	Austin, TX	44	240
Roper, David L	Austin, TX	54	516
Villani, Joseph	Sugar Land, TX	2	1
Wehrly,, JR James Douglas	-	30	18

Cited Art

Patent Info	# Cites	Year
OVID DATA CO. LLC (42)
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5,455,740 Bus communication system for stacked high density integrated circuit packages	76	1994
5,572,065 Hermetically sealed ceramic integrated circuit heat dissipating package	94	1994
5,592,364 High density integrated circuit module with complex electrical interconnect rails	41	1995
5,804,870 Hermetically sealed integrated circuit lead-on package configuration	69	1995
5,612,570 Chip stack and method of making same	172	1995
5,479,318 Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends	65	1995
5,493,476 Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends	50	1995
5,801,437 Three-dimensional warp-resistant integrated circuit module method and apparatus	81	1995
5,654,877 Lead-on-chip integrated circuit apparatus	81	1995
5,541,812 Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame	49	1995
5,778,522 Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief	51	1996
5,828,125 Ultra-high density warp-resistant memory module	62	1996
5,783,464 Method of forming a hermetically sealed circuit lead-on package	54	1997
5,869,353 Modular panel stacking process	131	1997
6,205,654 Method of manufacturing a surface mount package	80	1998
6,310,392 Stacked micro ball grid array packages	47	1998
6,323,060 Stackable flex circuit IC package and method of making same	111	1999
6,288,907 High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief	60	1999
6,262,895 Stackable chip package with flex carrier	153	2000
6,351,029 Stackable flex circuit chip package and method of making same	71	2000
6,404,043 Panel stacking of BGA devices to form three-dimensional modules	58	2000
6,608,763 Stacking system and method	36	2000
6,360,433 Universal package and method of forming the same	64	2000
6,919,626 High density integrated circuit module	71	2001
6,462,408 Contact member stacking system and method	45	2001
6,472,735 Three-dimensional memory stacking using anisotropic epoxy interconnections	109	2001
6,473,308 Stackable chip package with flex carrier	81	2001
6,426,240 Stackable flex circuit chip package and method of making same	74	2001
6,514,793 Stackable flex circuit IC package and method of making same	66	2001
6,627,984 Chip stack with differing chip package types	77	2001
6,544,815 Panel stacking of BGA devices to form three-dimensional modules	33	2001
6,576,992 Chip scale stacking system and method	97	2001
6,566,746 Panel stacking of BGA devices to form three-dimensional modules	49	2001
7,081,373 CSP chip stack with flex circuit	21	2001
6,572,387 Flexible circuit connector for stacked chip module	72	2002
6,940,729 Integrated circuit stacking system and method	22	2002
6,908,792 Chip stack with differing chip package types	51	2002
6,878,571 Panel stacking of BGA devices to form three-dimensional modules	77	2002
6,914,324 Memory expansion and chip scale stacking system and method	71	2003
7,371,609 Stacked module systems and methods	2	2004
7,180,167 Low profile stacking system and method	28	2004
INTERNATIONAL BUSINESS MACHINES CORPORATION (32)
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5,208,729 Multi-chip module	52	1992
5,243,133 Ceramic chip carrier with lead frame or edge clip	57	1992
5,229,916 Chip edge interconnect overlay element	117	1992
5,343,366 Packages for stacked integrated circuit chip cubes	96	1992
5,268,815 High density, high performance memory circuit package	58	1992
5,313,097 High density memory module	130	1992
5,384,690 Flex laminate package for a parallel processor	27	1993
5,337,388 Matrix of pluggable connectors for connecting large numbers of clustered electrical and/or opticcal cables to a module	41	1993
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5,523,619 High density memory structure	131	1993
5,502,333 Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit	168	1994
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5,620,782 Method of fabricating a flex laminate package	30	1995
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5,953,214 Dual substrate package assembly coupled to a conducting member	73	1996
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6,336,262 Process of forming a capacitor with multi-level interconnection technology	71	1997
6,111,757 SIMM/DIMM memory module	123	1998
5,926,369 Vertically integrated multi-chip circuit package with heat-sink support	106	1998
6,178,093 Information handling system with circuit assembly having holes filled with filler material	81	1998
6,444,490 Micro-flex technology in semiconductor packages	41	2001
2005/0108,468 MEMORY DEVICE WITH PROGRAMMABLE RECEIVERS TO IMPROVE PERFORMANCE	38	2003
6,893,897 Stacked package for integrated circuits	27	2004
MICRON TECHNOLOGY, INC. (29)
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4,992,850 Directly bonded simm module	163	1989
5,012,323 Double-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframe	258	1989
5,138,434 Packaging for semiconductor logic devices	232	1991
5,140,405 Semiconductor assembly utilizing elastomeric single axis conductive interconnect	127	1991
5,214,307 Lead frame for semiconductor devices having improved adhesive bond line control	80	1991
5,400,003 Inherently impedance matched integrated circuit module	73	1993
5,714,802 High-density electronic module	58	1994
6,008,538 Method and apparatus providing redundancy for fabricating highly reliable memory modules	41	1996
6,060,339 Method and apparatus providing redundancy for fabricating highly reliable memory modules	37	1997
6,303,981 Semiconductor package having stacked dice and leadframes and method of fabrication	243	1999
6,215,181 Method and apparatus providing redundancy for fabricating highly reliable memory modules	33	1999
6,214,641 Method of fabricating a multi-chip module	125	1999
6,522,018 Ball grid array chip packages having improved testing and stacking characteristics	56	2000
6,778,404 Stackable ball grid array	35	2000
6,552,910 Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture	155	2000
6,265,660 Package stack via bottom leaded plastic (BLP) packaging	76	2000
6,884,653 Folded interposer	79	2001
6,531,772 Electronic system including memory module with redundant memory capability	29	2001
6,746,894 Ball grid array interposer, packages and methods	79	2001
6,416,386 Apparatus and methods for substantial planarization of solder bumps	4	2001
6,841,868 Memory modules including capacity for additional memory	36	2001
6,500,697 Leadframes including offsets extending from a major plane thereof, packaged semiconductor devices including same, and methods of designing and fabricating such leadframes	18	2001
6,560,117 Packaged microelectronic die assemblies and methods of manufacture	148	2001
6,709,893 Interconnections for a semiconductor device and method for forming same	44	2001
6,559,521 Chip carrier with magnetic shielding	24	2002
2003/0164,551 Method and apparatus for flip-chip packaging providing testing capability	37	2002
6,720,652 Apparatus providing redundancy for fabricating highly reliable memory modules	39	2002
7,235,871 Stacked microelectronic dies	15	2003
TESSERA, INC. (22)
5,347,159 Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate	194	1991
6,121,676 Stacked microelectronic assembly and method therefor	161	1997
6,114,763 Semiconductor package with translator for connection to an external substrate	46	1998
5,852,326 Face-up semiconductor chip assembly	64	1998
6,225,688 Stacked microelectronic assembly and method therefor	182	1999
6,465,893 Stacked chip assembly	105	2000
6,765,288 Microelectronic adaptors, assemblies and methods	55	2002
6,897,565 Stacked packages	23	2002
7,149,095 Stacked microelectronic assemblies	31	2002
6,940,158 Assemblies having stacked semiconductor chips and methods of making same	33	2003
6,977,440 Stacked packages	29	2003
6,873,039 Methods of making microelectronic packages including electrically and/or thermally conductive element	12	2003
7,053,485 Microelectronic packages with self-aligning features	13	2003
7,246,431 Methods of making microelectronic packages including folded substrates	12	2003
7,071,547 Assemblies having stacked semiconductor chips and methods of making same	29	2003
6,978,538 Method for making a microelectronic interposer	13	2003
2004/0075,991 Vapor phase connection techniques	39	2003
2004/0217,471 Component and assemblies with ends offset downwardly	39	2004
6,913,949 Stacked packages	23	2004
2004/0245,617 Dense multichip module	48	2004
2004/0217,461 Microelectronic adaptors, assemblies and methods	37	2004
2005/0035,440 Stacked chip assembly with stiffening layer	42	2004
SAMSUNG ELECTRONICS CO., LTD. (15)
5,594,275 J-leaded semiconductor package having a plurality of stacked ball grid array packages	135	1994
5,677,569 Semiconductor multi-package stack	124	1995
5,744,827 Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements	168	1996
5,841,721 Multi-block erase and verification circuit in a nonvolatile semiconductor memory device and a method thereof	82	1997
6,849,949 Thin stacked package	45	2000
6,452,826 Memory module system	96	2001
6,768,660 Multi-chip memory devices and modules including independent control of memory chips	67	2001
6,614,664 Memory module having series-connected printed circuit boards	75	2001
6,781,240 Semiconductor package with semiconductor chips stacked therein and method of making the package	39	2002
6,891,729 Memory module	33	2002
6,876,074 Stack package using flexible double wiring substrate	55	2002
6,812,567 Semiconductor package and package stack made thereof	38	2003
2005/0040,508 Area array type package stack and manufacturing method thereof	41	2004
7,129,571 Semiconductor chip package having decoupling capacitor and manufacturing method thereof	29	2004
2005/0133,897 Stack package with improved heat radiation and module having the stack package mounted thereon	68	2004
ROUND ROCK RESEARCH, LLC (12)
6,097,087 Semiconductor package including flex circuit, interconnects and dense array external contacts	300	1997
6,028,365 Integrated circuit package and method of fabrication	261	1998
6,013,948 Stackable chip scale semiconductor package with mating contacts on opposed surfaces	319	1998
5,899,705 Stacked leads-over chip multi-chip module	106	1998
6,072,233 Stackable ball grid array package	300	1998
6,347,394 Buffering circuit embedded in an integrated circuit device module used for buffering clocks and other input signals	41	1998
6,368,896 Method of wafer level chip scale packaging	145	1999
6,165,817 Method of bonding a flexible polymer tape to a substrate to reduce stresses on the electrical connections	47	1999
6,265,766 Flip chip adaptor package for bare die	140	2000
6,465,877 Semiconductor package including flex circuit, interconnects and dense array external contacts	117	2000
6,462,423 Flip-chip with matched lines and ground plane	46	2000
7,115,986 Flexible ball grid array chip scale packages	23	2001
RAMBUS INC. (11)
6,002,589 Integrated circuit package for coupling to a printed circuit board	77	1997
6,234,820 Method and apparatus for joining printed circuit boards	90	1997
6,370,668 High speed memory system capable of selectively operating in non-chip-kill and chip-kill modes	43	1999
6,447,321 Socket for coupling an integrated circuit package to a printed circuit board	21	1999
6,502,161 Memory system including a point-to-point linked memory subsystem	306	2000
6,449,159 Semiconductor module with imbedded heat spreader	99	2000
6,349,050 Methods and systems for reducing heat flux in memory systems	45	2000
6,552,948 Methods and systems for reducing heat flux in memory systems	35	2001
6,833,984 Semiconductor module with serial bus connection to multiple dies	95	2002
6,839,266 Memory module with offset data lines and bit line swizzle configuration	65	2002
6,721,226 Methods and systems for reducing heat flux in memory systems	33	2003
TEXAS INSTRUMENTS INCORPORATED (11)
4,712,129 Integrated circuit device with textured bar cover	47	1985
5,025,306 Assembly of semiconductor chips	125	1988
5,219,377 High temperature co-fired ceramic integrated phased array package	59	1992
5,402,006 Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound	62	1992
5,600,178 Semiconductor package having interdigitated leads	36	1995
6,084,778 Three dimensional assembly using flexible wiring board	30	1998
6,285,560 Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified	58	1999
6,689,634 Modeling technique for selectively depopulating electrical contacts from a foot print of a grid array (BGA or LGA) package to increase device reliability	24	1999
6,489,178 Method of fabricating a molded package for micromechanical devices	68	2001
2002/0114,143 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates	31	2002
6,858,910 Method of fabricating a molded package for micromechanical devices	18	2002
NEC CORPORATION (9)
4,724,611 Method for producing semiconductor module	42	1986
5,240,588 Method for electroplating the lead pins of a semiconductor device pin grid array package	63	1992
5,717,556 Printed-wiring board having plural parallel-connected interconnections	78	1996
5,805,422 Semiconductor package with flexible board and method of fabricating the same	133	1997
5,895,970 Semiconductor package having semiconductor element, mounting structure of semiconductor package mounted on circuit board, and method of assembling semiconductor package	53	1998
6,271,058 Method of manufacturing semiconductor device in which semiconductor chip is mounted facedown on board	41	1999
6,358,772 Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package	40	1999
6,166,443 Semiconductor device with reduced thickness	36	1999
6,998,704 Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus	31	2003
SEIKO EPSON CORPORATION (9)
5,119,269 Semiconductor with a battery unit	56	1990
6,486,544 Semiconductor device and method manufacturing the same, circuit board, and electronic instrument	99	2000
6,441,476 Flexible tape carrier with external terminals formed on interposers	18	2000
6,670,700 Interconnect substrate and semiconductor device electronic instrument	33	2001
6,469,377 Semiconductor device	7	2001
6,677,670 Semiconductor device	69	2001
6,867,496 Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument	29	2001
6,489,687 Semiconductor device and method of manufacturing the same, manufacturing device, circuit board, and electronic equipment	99	2001
6,646,335 Flexible tape carrier with external terminals formed on interposers	33	2002
STAKTEK GROUP L.P. (9)
5,279,029 Ultra high density integrated circuit packages method	283	1993
5,475,920 Method of assembling ultra high density integrated circuit packages	55	1994
5,543,664 Ultra high density integrated circuit package	71	1995
5,499,160 High density integrated circuit module with snap-on rail assemblies	59	1995
5,644,161 Ultra-high density warp-resistant memory module	92	1995
5,631,193 High density lead-on-package fabrication method	74	1995
5,588,205 Method of manufacturing a high density integrated circuit module having complex electrical interconnect rails	49	1995
2002/0094,603 Three-dimensional memory stacking using anisotropic epoxy interconnections	40	2002
2003/0064,548 Panel stacking of BGA devices to form three-dimensional modules	87	2002
INTEL CORPORATION (8)
5,168,926 Heat sink design integrating interface material	84	1991
5,375,041 Ra-tab array bump tab tape based I.C. package	96	1992
5,362,656 Method of making an electronic assembly having a flexible circuit wrapped around a substrate	76	1994
6,233,650 Using FET switches for large memory arrays	111	1998
6,532,162 Reference plane of integrated circuit packages	27	2001
6,600,222 Stacked microelectronic packages	115	2002
6,869,825 Folded BGA package design with shortened communication paths and more electrical routing flexibility	38	2002
6,841,855 Electronic package having a flexible substrate with ends connected to one another	26	2003
FREESCALE SEMICONDUCTOR, INC. (7)
5,222,014 Three-dimensional multi-chip pad array carrier	390	1992
5,247,423 Stacking three dimensional leadless multi-chip module and method for making the same	165	1992
5,239,198 Overmolded semiconductor device having solder ball and edge lead connective structure	305	1992
5,386,341 Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape	161	1993
5,789,815 Three dimensional semiconductor package having flexible appendages	96	1996
6,040,624 Semiconductor device package and method	93	1997
6,111,761 Electronic assembly	23	1999
FUJITSU LIMITED (7)
4,682,207 Semiconductor device including leadless packages and a base plate for mounting the leadless packages	60	1986
5,801,439 Semiconductor device and semiconductor device unit for a stack arrangement	106	1997
6,102,710 Controlled impedance interposer substrate and method of making	41	1998
6,187,652 Method of fabrication of multiple-layer high density substrate	77	1998
6,444,921 Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like	100	2000
6,690,584 Information-processing device having a crossbar-board connected to back panels on different sides	75	2001
6,521,530 Composite interposer and method for producing a composite interposer	94	2001
QIMONDA AG (7)
6,573,593 Integrated circuit with a housing accommodating the integrated circuit	36	1999
6,646,333 Semiconductor module having interconnected semiconductor chips disposed one above the other	16	2000
6,538,895 TSOP memory chip housing configuration	21	2002
6,850,414 Electronic printed circuit board having a plurality of identically designed, housing-encapsulated semiconductor memories	39	2002
6,724,076 Package for a semiconductor chip	28	2003
6,927,484 Stack arrangement of a memory module	11	2003
7,023,701 Device for cooling memory modules	49	2004
RENESAS ELECTRONICS CORPORATION (7)
5,357,478 Semiconductor integrated circuit device including a plurality of cell array blocks	69	1991
5,219,794 Semiconductor integrated circuit device and method of fabricating same	100	1992
5,744,862 Reduced thickness semiconductor device with IC packages mounted in openings on substrate	79	1996
6,147,398 Semiconductor device package	7	1997
5,895,969 Thin type semiconductor device, module structure using the device and method of mounting the device on board	28	1997
6,984,885 Semiconductor device having densely stacked semiconductor chips	23	2000
6,646,936 Semiconductor memory device shiftable to test mode in module as well as semiconductor memory module using the same	47	2002
KABUSHIKI KAISHA TOSHIBA (6)
4,972,580 Method for connecting electronic components with dummy patterns	57	1989
5,394,010 Semiconductor assembly having laminated semiconductor devices	90	1992
5,394,303 Semiconductor device	226	1993
6,492,718 Stacked semiconductor device and semiconductor system	95	2000
6,528,870 Semiconductor device having a plurality of stacked wiring boards	81	2001
6,956,883 Semiconductor laser device including light receiving element for receiving monitoring laser beam	19	2002
MITSUBISHI DENKI KABUSHIKI KAISHA (6)
5,173,840 Molded IC card	83	1991
5,252,855 Lead frame having an anodic oxide film coating	60	1991
5,394,300 Thin multilayered IC memory card	61	1993
5,835,988 Packed semiconductor device with wrap around external leads	341	1996
6,038,132 Memory module	107	1997
6,084,294 Semiconductor device comprising stacked semiconductor elements	79	1999
ENTORIAN TECHNOLOGIES INC. (5)
5,420,751 Ultra high density modular integrated circuit package	104	1993
5,446,620 Ultra high density integrated circuit packages	72	1993
5,561,591 Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package	51	1994
5,566,051 Ultra high density integrated circuit packages method and apparatus	76	1994
6,025,642 Ultra high density integrated circuit packages	50	1997
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (5)
5,014,161 System for detachably mounting semiconductors on conductor substrate	141	1990
5,050,039 Multiple circuit chip mounting and cooling arrangement	53	1990
5,158,912 Integral heatsink semiconductor package	53	1991
5,191,404 High density memory array packaging	118	1991
6,588,095 Method of processing a device by electrophoresis coating	53	2001
MOTOROLA, INC. (5)
4,672,421 Semiconductor packaging and method	56	1986
5,041,902 Molded electronic package with compression structures	239	1989
5,014,115 Coplanar waveguide semiconductor package	47	1990
5,432,630 Optical bus with optical transceiver modules and method of manufacture	109	1992
5,438,224 Integrated circuit package having a face-to-face IC chip arrangement	168	1993
SILICON GRAPHICS INTERNATIONAL, CORP. (5)
5,686,730 Dimm pair with data memory and state memory	42	1996
5,790,447 High-memory capacity DIMM with data and state memory	64	1996
6,172,874 System for stacking of integrated circuit packages	95	1998
6,078,515 Memory system with multiple addressing and control busses	85	1998
6,629,855 Memory system including guides that receive memory modules	43	1999
SUN MICROSYSTEMS, INC. (5)
5,065,277 Three dimensional packaging arrangement for computer systems and the like	92	1990
5,963,427 Multi-chip module with flexible circuit board	79	1997
6,428,360 Memory module with offset notches for improved insertion and stability and memory module connector	42	2001
6,721,185 Memory module having balanced data I/O contacts pads	67	2001
2003/0090,879 Dual inline memory module	136	2002
APROLASE DEVELOPMENT CO., LLC (4)
4,983,533 High-density electronic modules - process and product	195	1987
5,104,820 Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting	234	1991
6,014,316 IC stack utilizing BGA contacts	110	1998
6,028,352 IC stack utilizing secondary leadframes	103	1998
HITACHI, LTD. (4)
4,758,875 Resin encapsulated semiconductor device	60	1981
5,159,434 Semiconductor device having a particular chip pad structure	60	1991
6,034,878 Source-clock-synchronized memory system and memory unit	213	1997
2003/0116,835 Memory-module and a method of manufacturing the same	50	2001
LOCKHEED MARTIN CORPORATION (4)
5,345,205 Compact high density interconnected microwave system	66	1990
5,241,456 Compact high density interconnect structure	211	1990
6,410,857 Signal cross-over interconnect for a double-sided circuit card assembly	68	2001
6,760,220 Rugged modular PC 104 chassis with blind mate connector and forced convection cooling capabilities	36	2002
NATIONAL SEMICONDUCTOR CORPORATION (4)
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5,783,870 Method for connecting packages of a stacked ball grid array structure	155	1995
6,624,507 Miniature semiconductor package for opto-electronic devices	29	2001
6,707,148 Bumped integrated circuits for optical applications	18	2002
URENSCHI ASSETS LIMITED LIABILITY COMPANY (4)
5,953,215 Apparatus and method for improving computer memory speed and capacity	158	1998
6,266,252 Apparatus and method for terminating a computer memory bus	114	1999
6,446,158 Memory system using FET switches to select memory banks	116	2000
6,737,891 Tri-directional, high-speed bus switch	12	2002
AMP INCORPORATED (3)
4,587,596 High density mother/daughter circuit board connector	102	1984
4,696,525 Socket for stacking integrated circuit packages	104	1985
5,259,770 Impedance controlled elastomeric connector	87	1992
FAIRCHILD SPACE AND DEFENSE CORPORATION (3)
5,491,612 Three-dimensional modular assembly of integrated circuits	142	1995
5,646,446 Three-dimensional flexible assembly of integrated circuits	165	1995
5,776,797 Three-dimensional flexible assembly of integrated circuits	173	1997
HITACHI TOHBU SEMICONDUCTOR, LTD. (3)
4,982,265 Semiconductor integrated circuit device and method of manufacturing the same	244	1988
5,198,888 Semiconductor stacked device	179	1990
6,756,661 Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device	157	2001
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (3)
4,645,944 MOS register for selecting among various data inputs	79	1984
4,903,169 Shielded high frequency apparatus having partitioned shield case, and method of manufacture thereof	30	1988
6,651,320 Method for mounting semiconductor element to circuit board	9	2000
MURATA MANUFACTURING CO., LTD. (3)
6,215,687 Semiconductor device and process for manufacturing the same	31	2000
6,288,924 Semiconductor device and process for manufacturing the same	40	2000
6,744,656 Semiconductor device and process for manufacturing the same	30	2002
NETLIST, INC. (3)
6,751,113 Arrangement of integrated circuits in a memory module	137	2002
2005/0018,495 ARRANGEMENT OF INTEGRATED CIRCUITS IN A MEMORY MODULE	79	2004
6,873,534 Arrangement of integrated circuits in a memory module	67	2004
SONY CORPORATION (3)
5,343,075 Composite stacked semiconductor device with contact plates	102	1992
6,462,412 Foldable, flexible laminate type semiconductor apparatus with reinforcing and heat-radiating plates	78	2001
2001/0040,793 Electronic device and method of producing the same	83	2001
WANG LABORATORIES, INC. (3)
4,656,605 Single in-line memory module	148	1986
4,727,513 Signal in-line memory module	75	1987
4,850,892 Connecting apparatus for electrically connecting memory modules to a printed circuit board	112	1988
XETEL CORPORATION (3)
5,509,197 Method of making substrate edge connector	20	1994
5,644,839 Surface mountable substrate edge terminal	27	1995
6,272,741 Hybrid solder ball and pin grid array circuit board interconnect system and method	19	1998
AMKOR TECHNOLOGY, INC. (2)
6,683,377 Multi-stacked memory package	88	2000
6,879,047 Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor	27	2003
CHIPPAC, INC. (2)
6,549,413 Tape ball grid array semiconductor package structure and assembly process	26	2002
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ELPIDA MEMORY, INC. (2)
6,157,541 Stack arrangement for two semiconductor memory chips and printed board for accepting a plurality of such stack arrangements	103	1998
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GENERAL MOTORS CORPORATION (2)
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OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (17)
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5,016,138 Three dimensional integrated circuit package	295	1989
5,281,852 Semiconductor device including stacked die	155	1991
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6,232,659 Thin multichip module	77	2000
6,392,162 Double-sided flexible jumper assembly and method of manufacture	64	2000
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6,509,639 Three-dimensional stacked semiconductor package	78	2002
7,291,906 Stack package and fabricating method thereof	8	2003

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