Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same
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United States of America Patent
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Feb 9, 2010
Grant Date -
May 31, 2007
app pub date -
Nov 29, 2006
filing date -
Jul 29, 2005
priority date (Note) -
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Abstract
A method and apparatus for process integration in manufacture of a ask are disclosed. In one embodiment, a cluster tool suitable for process integration in manufacture of a photomask including a vacuum transfer chamber having coupled thereto at least one hard mask deposition chamber and at least one plasma chamber configured for etching chromium. In another embodiment, a method for process integration in manufacture of a photomask includes depositing a hard mask on a substrate in a first processing chamber, depositing a resist layer on the substrate, patterning the resist layer, etching the hard mask through apertures formed in the patterned resist layer in a second chamber; and etching a chromium layer through apertures formed in the hard mask in a third chamber.
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