Method of manufacturing a hermetic chamber with electrical feedthroughs
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United States of America Patent
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Feb 16, 2010
Grant Date -
Aug 10, 2006
app pub date -
Dec 20, 2005
filing date -
Feb 10, 2005
priority date (Note) -
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Abstract
A method of manufacturing a hermetically-sealed chamber with an electrical feedthrough includes the step of hermetically fixing an electrode to a substrate in a predetermined location on the substrate. A passage is formed through the substrate through the predetermined location such that at least a portion of the electrode is exposed to the passage. The passage is then at least partially filled with an electrically conductive material. A housing is then formed including the substrate such that the housing defines a chamber, with the electrode being disposed within the housing and the chamber being hermetically sealed. The electrode within the chamber can be placed in electrical communication with an exterior electrical component by way of the electrically conductive material in the passage.
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