US Patent No: 7,663,252
Number of patents in Portfolio can not be more than 2000
Electric power semiconductor device
Stats
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Feb 16, 2010
Issued date -
Oct 16, 2007
filing date -
11/873,030
serial no -
In Force
status
Importance
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Abstract
An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 6,054,754 Multi-capacitance lead frame decoupling device | 28 | 1997 | |
| 6,184,574 Multi-capacitance lead frame decoupling device | 21 | 1999 | |
| 6,310,388 Semiconductor die assembly having leadframe decoupling characters | 10 | 2000 | |
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| 6,836,006 Semiconductor module | 8 | 1999 | |
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| 5,422,435 Stacked multi-chip modules and method of manufacturing | 284 | 1992 | |
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| 5,402,318 Semiconductor integrated circuit device | 28 | 1993 | |
Patent Citation Ranking
Maintenance Fees
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