Printed circuit board having embedded RF module power stage circuit
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United States of America Patent
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Feb 16, 2010
Grant Date -
Dec 28, 2006
app pub date -
Jun 7, 2006
filing date -
Jun 22, 2005
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed herein is a printed circuit board having an RF module power stage circuit embedded therein. Specifically, this invention relates to a printed circuit board having an RF module power stage circuit embedded therein, in which a terminal pad for a resistor, a bead, or an inductor is defined or formed on a power supply plane of a multilayered wired board to connect the resistor, the bead, or the inductor to the power supply plane, and the resistor, the bead, or the inductor is connected in parallel with a decoupling capacitor by using a via hole or by embedding the resistor, the bead or the inductor perpendicular to the power supply plane, thus decreasing the size of the RF module and improving the performance thereof.
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