Temperature sensor assembly and method of manufacturing thereof
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United States of America Patent
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Feb 23, 2010
Grant Date -
Jan 31, 2008
app pub date -
Jun 22, 2007
filing date -
Jun 22, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
A temperature sensor assembly and method of manufacturing thereof having a temperature probe, a mounting connector, a wire set, a transition component, a housing, and a circuit is provided. The temperature probe includes a probe body, a temperature sensor and at least one conductor configured for providing a temperature signal indicative of a temperature over the at least one conductor. The circuit is enclosed within the housing and configured for receiving the temperature signal from the temperature probe and generating the temperature characteristic in response to the received temperature signal.
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