Polyceramic e-chuck
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United States of America Patent
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Feb 23, 2010
Grant Date -
Jan 1, 2009
app pub date -
Jun 29, 2007
filing date -
Jun 29, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention discloses an electrostatic chuck for clamping work substrates, said chuck comprising three layers, where the dielectric constant of included non-conductive layers is selected to provide overall lower capacitance to the chuck. In the chuck assembly of the present invention, the top dielectric layer that is in contact with a substrate, such as, a wafer, has a dielectric constant that is preferably greater than about 5, with a resistivity that is preferably greater than about 1E6 ohm.m, whereas the bottom dielectric layer has a dielectric constant that is preferably less than about 5 and a resistivity that is preferably greater than about 1E10 ohm.m. The intermediate layer preferably has a conductive layer where the resistivity is less than about 1 ohm.m.
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