US Patent No: 7,671,373
Number of patents in Portfolio can not be more than 2000
LED chip package structure using a ceramic material as a substrate and a method for manufacturing the same
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Mar 2, 2010
Issued date -
Oct 25, 2007
filing date -
11/976,478
serial no -
In Force
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Abstract
An LED chip package structure using a ceramic material as a substrate includes a ceramic substrate, a conductive unit, a hollow ceramic casing, a plurality of LED chips, and a package colloid. The ceramic substrate has a main body, and a plurality of protrusions extended from three faces of the main body. The conductive unit has a plurality of conductive layers formed on the protrusions, respectively. The hollow casing is fixed on a top face of the main body to form a receiving space for exposing a top face of each conductive layer. The LED chips are received in the receiving space, and each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected to different conductive layers. In addition, the packaging colloid is filled into the receiving space for covering the LED chips.
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First Claim
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 7,230,280 Collimating light from an LED device | 5 | 2004 | |
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| 6,914,267 Light emitting diode | 59 | 2004 | |
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| 6,069,440 Light emitting device having a nitride compound semiconductor and a phosphor containing a garnet fluorescent material | 208 | 1999 | |
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| 6,874,910 Light source device using LED, and method of producing same | 64 | 2003 | |
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| 6,121,637 Semiconductor light emitting device with increased luminous power | 31 | 1998 | |
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| 7,012,277 Semiconductor light emitting device | 3 | 2003 | |
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