Method of manufacturing a semiconductor device
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United States of America Patent
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Mar 9, 2010
Grant Date -
Nov 23, 2006
app pub date -
Jul 31, 2006
filing date -
Mar 19, 2001
priority date (Note) -
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Abstract
The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an array substrate is normally performed and can decrease a manufacturing cost by eliminating wastes to keep a defective product forming.An electromotive force generated by electromagnetic induction is rectified and shaped by using primary coils formed on a check substrate and secondary coils formed on an array substrate, whereby a power source voltage and a driving signal are supplied to circuits or circuit elements on a TFT substrate so as to be driven.
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