Electronic device package heat sink assembly

United States of America Patent

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Mar 9, 2010
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Jun 13, 2006
filing date
Jun 13, 2005

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Abstract

An electronic package includes a flat base having a notch formed at opposite ends of the base. A clamping mechanism has a boss adapted to the notch for matingly connecting to the base, and includes an aperture for receiving a fastener for securing the package to a substrate or heat sink.

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Patent Owner(s)

Patent Owner	Address
ELECTRO CERAMIC INDUSTRIES	75 KENNEDY STREET HACKENSACK NJ 07601

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Schlomann, Herbert W	Oradell, US	3	15

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Electronic device package heat sink assembly

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United States of America Patent

11452126

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US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 09, 2010	US,7675167,B2 US7675167B2	GRANTED PATENT AS SECOND PUBLICATION
December 14, 2006	US,20060279934,A1 US20060279934A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	7675167
SERIAL NO	11452126
DOCKET NO

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11452126

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