Stacked electronic component package having film-on-wire spacer
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United States of America Patent
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Mar 9, 2010
Grant Date -
N/A
app pub date -
Feb 17, 2006
filing date -
Feb 17, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A film-on-wire spacer covers an entire upper surface of a lower electronic component. Accordingly, an upper electronic component is supported above bond pads and lower bond wires of the lower electronic component. This decreases the stress on the upper electronic component, e.g., during wirebonding, and thus decreases the chance of cracking the upper electronic component. Further, the lower bond wires are enclosed in and protected by the film-on-wire spacer. Further, the film-on-wire spacer is thin resulting in a minimum height of the stacked electronic component package.
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