Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor
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United States of America Patent
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Mar 16, 2010
Grant Date -
Dec 20, 2007
app pub date -
Mar 20, 2007
filing date -
Jun 20, 2006
priority date (Note) -
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Abstract
A method for manufacturing a capacitive semiconductor sensor includes: forming a plurality of circuit chips in a wafer, wherein each circuit chip includes a pad for testing a sensor chip; bonding the sensor chip on each circuit chip with a bump so that the sensor chip is electrically coupled with the circuit chip, wherein each sensor chip is made of semiconductor and has a capacitance changing portion, which is disposed on one side of the sensor chip and has a variable capacitance, wherein the circuit chip detects a capacitance change of the sensor chip, and wherein the one side of the sensor chip faces the circuit chip; testing each sensor chip through the pad; and cutting the wafer into individual circuit chips so that the circuit chip and the sensor chip provide the capacitive semiconductor sensor.
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