Cantilever probe card
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United States of America Patent
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-
Mar 16, 2010
Grant Date -
Aug 28, 2008
app pub date -
Feb 28, 2007
filing date -
Feb 28, 2007
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and apparatus for a flattened probe element wire is provided. A probe element wire includes a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may includes a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.
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