Integrated circuit package system employing structural support
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United States of America Patent
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Mar 23, 2010
Grant Date -
Jun 12, 2008
app pub date -
Dec 7, 2006
filing date -
Dec 7, 2006
priority date (Note) -
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Abstract
An integrated circuit package system that includes: providing an electrical interconnect system including a support structure and a lead-finger system; stacking a first device over the support structure; stacking a second device over the first device; connecting the first device and the second device to the lead-finger system; stacking a dummy device over the second device; and exposing a support structure bottom side and a dummy device top side for thermal dissipation.
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