Stacked integrated circuit package system and method of manufacture therefor
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United States of America Patent
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Mar 30, 2010
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N/A
app pub date -
Mar 10, 2008
filing date -
Apr 29, 2005
priority date (Note) -
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Abstract
An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit, attaching a substrate electrical connector between the core substrate and the base substrate, and applying an encapsulant having the core substrate partially exposed over the base integrated circuit.
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