Pre-patterned thin film capacitor and method for embedding same in a package substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 30, 2010
Grant Date -
Mar 22, 2007
app pub date -
Nov 17, 2006
filing date -
Jun 23, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An embedded passive structure, its method of formation, and its integration onto a substrate during fabrication are disclosed. In one embodiment, the embedded passive structure is a thin film capacitor (TFC) formed using a thin film laminate that has been mounted onto a substrate. The TFC's capacitor dielectric and/or lower electrode layers are patterned in such a way as to reduce damage and improve cycle time. In one embodiment, the capacitor dielectric has a high dielectric constant and the substrate is an organic packaging substrate.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully