Wafer probe
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 30, 2010
Issued Date -
N/A
app pub date -
Apr 26, 2007
filing date -
Dec 4, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a probe tip assembly for testing of integrated circuits or other microelectronic devices. The probe tip assembly may include a plurality of independently flexible contact fingers extending from a support, each contact finger spaced apart from the other contact fingers, and each contact finger terminating in free space at an end distal from the support. A probe may be constructed by attaching the free ends of the contact fingers to electrical contacts on a circuit board and then removing the support from the contact fingers.
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