Bonding system having stress control
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United States of America Patent
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Apr 6, 2010
Grant Date -
Jul 13, 2006
app pub date -
Jan 7, 2005
filing date -
Jan 7, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An approach where items of different temperatures are bonded to each other such that upon cooling down they contract in size resulting in zero residual stress between the bonded items at an ambient temperature. If materials of the bonded items have different thermal expansion coefficients and the items are put together at different bonding temperatures, then they may have insignificant residual stress upon cooling down to the ambient temperature (e.g., room temperature) because the different ranges of the temperature drops compensate for the different contractions.
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