Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
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United States of America Patent
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Apr 6, 2010
Grant Date -
Dec 6, 2007
app pub date -
Jul 2, 2007
filing date -
Jul 13, 2004
priority date (Note) -
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Abstract
A multipackage module has multiple die of various types and having various functions and, in some embodiments, the module includes a digital processor, an analog device, and memory. A first die, having a comparatively large footprint, is mounted onto first die attach region on a surface of a first package substrate. A second die, having a significantly smaller footprint, is mounted upon the surface of the first die, on a second die attach region toward one edge of the first die. The first die is electrically connected by wire bonds to conductive traces in the die-attach side of the substrate. The second die is electrically connected by wire bonds to the first package substrate, and may additionally be electrically connected by wire bonds to the first die.
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