US Patent No: 7,692,287
Number of patents in Portfolio can not be more than 2000
Semiconductor device and wiring board
Stats
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Apr 6, 2010
Issued date -
May 18, 2005
filing date -
11/569,402
serial no -
In Force
status
Importance
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Abstract
A wiring board (20A) includes a first wiring portion (10A) having a plurality of wiring layers (1) and external connecting bumps (5), and at least one second wiring portion (15A) having a plurality of contact plugs (14). The second wiring portion is integrated with the first wiring portion such that each terminal (14a) of the second wiring portion is in direct contact with one of the wiring layers of the first wiring portion. Hence, there is no risk to produce an internal stress caused by the diffused component of the solder bump in the junction portion between the second and first wiring portions. Accordingly, even when a semiconductor chip (30) of a low-k material is highly integrated on the wiring board, a highly reliable semiconductor device (50) can be obtained.
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First Claim
Related Publications
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 5,870,289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate | 224 | 1995 | |
| 6,380,621 Semiconductor device and manufacturing method thereof | 12 | 2000 | |
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| 6,175,160 Flip-chip having an on-chip cache memory | 33 | 1999 | |
| 6,617,681 Interposer and method of making same | 41 | 1999 | |
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| 6,900,534 Direct attach chip scale package | 5 | 2001 | |
| 7,390,700 Packaged system of semiconductor chips having a semiconductor interposer | 4 | 2006 | |
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| 5,258,648 Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery | 227 | 1992 | |
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| 5,790,384 Bare die multiple dies for direct attach | 92 | 1997 | |
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| 7,045,886 Semiconductor device and method of fabricating the same | 4 | 2003 | |
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| 2004/0173,891 Intermediate board, intermediate board with a semiconductor device, substrate board with an intermediate board, structural member including a semiconductor device, an intermediate board and a substrate board, and method of producing an intermediate board | 20 | 2004 | |
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| 5,814,894 Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device | 96 | 1996 | |
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| 6,472,735 Three-dimensional memory stacking using anisotropic epoxy interconnections | 109 | 2001 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Oct 6, 2013 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Oct 6, 2017 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Oct 6, 2021 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |