US Patent No: 7,692,287

Number of patents in Portfolio can not be more than 2000

Semiconductor device and wiring board

ALSO PUBLISHED AS: 20080237890

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Importance

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Abstract

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A wiring board (20A) includes a first wiring portion (10A) having a plurality of wiring layers (1) and external connecting bumps (5), and at least one second wiring portion (15A) having a plurality of contact plugs (14). The second wiring portion is integrated with the first wiring portion such that each terminal (14a) of the second wiring portion is in direct contact with one of the wiring layers of the first wiring portion. Hence, there is no risk to produce an internal stress caused by the diffused component of the solder bump in the junction portion between the second and first wiring portions. Accordingly, even when a semiconductor chip (30) of a low-k material is highly integrated on the wiring board, a highly reliable semiconductor device (50) can be obtained.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
ET US HOLDINGS LLCTROY, MI86
NEC CORPORATIONTOKYO18772

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tago, Masamoto Tokyo, JP 55 530

Cited Art Landscape

Patent Info (Count) # Cites Year
 
HITACHI, LTD. (2)
5,870,289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate 248 1995
6,380,621 Semiconductor device and manufacturing method thereof 18 2000
 
INTEL CORPORATION (2)
6,175,160 Flip-chip having an on-chip cache memory 36 1999
6,617,681 Interposer and method of making same 50 1999
 
TEXAS INSTRUMENTS INCORPORATED (2)
6,900,534 Direct attach chip scale package 5 2001
7,390,700 Packaged system of semiconductor chips having a semiconductor interposer 9 2006
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,258,648 Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery 239 1992
 
INVENSAS CORPORATION (1)
5,790,384 Bare die multiple dies for direct attach 96 1997
 
KABUSHIKI KAISHA TOSHIBA (1)
7,045,886 Semiconductor device and method of fabricating the same 4 2003
 
NGK SPARK PLUG CO., LTD. (1)
2004/0173,891 Intermediate board, intermediate board with a semiconductor device, substrate board with an intermediate board, structural member including a semiconductor device, an intermediate board and a substrate board, and method of producing an intermediate board 39 2004
 
NITTO DENKO CORPORATION (1)
5,814,894 Semiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor device 101 1996
 
OVID DATA CO. LLC (1)
6,472,735 Three-dimensional memory stacking using anisotropic epoxy interconnections 123 2001

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